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PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

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PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

Name: PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer
Brand: Easun
Price: 1 USD

Quality PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer for sale

Brand Name : Easun

Model Number : ES225

Certification : Rosh, Reach

Place of Origin : China

MOQ : 20KG

Price : Negotiable

Payment Terms : T/T

Supply Ability : 4000000

Delivery Time : 3-8 working day

Packaging Details : 20KG/bag

Color : White

Composition : Polyurethane

Appearance : Powder

Melt Point(DSC) : 100-120 ℃

Melt Flow Index : 20±5 g/10min

Washable Property : 40 ℃

Powder size range : 0-80 μm; 80-200 μm;150-250 μm

Density : 1.18±0.03 g/cm³

Hardness : 75±2 Shore A

Packaging : 20KG in one PE bag+Brown paper

Product type : TPU Hot Melt Adhesive Powder

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PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

Product model: ES225

TPU Hot Melt Adhesive Powder Description: hot melt adhesive powder of thermoplastic polyurethane. It has a soft feel and good resilience, stretching; easy processing; It has excellent bonding properties for textiles.

Function:Heat transfer,Digital printing,Silk screen printing.

Physical Characteristics:

Property	Criterion
Appearance	White powder
Composition	TPU
Density ASTM D-792	1.18±0.03 g/cm³
Melt Point DSC	100-120 ℃
Melt Index ASTM D-1238	75±2 Shore A
Powder size range	0-80 um
	80-200 um
	150-250 um

Technical Parameters:

Bonding parameters (for reference only)	Temperature	115-130℃
	Press	0.5-1.5 kg/cm2
	Time	8-15S
Washing Resistance	40℃	Excellent
	60℃	/
	90℃	/

Packaging and Storage Conditions:

Packaging	20KG in one PE bag+Brown paper bag
Storage Conditions	Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

Product Tags:

DTF Hot Melt Adhesive Powder

PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer Images

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